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TRSYS20 熱フラックス計測システム

High-accuracy in-situ building R-value measurements

TRSYS20 is a high-accuracy measuring system used in determining the in-situ thermal resistance (R-value), thermal conductance (Λ-value), and thermal transmittance (U-value) of building envelope components. The system is mostly used for measurements according to standard practices of ISO 9869, ASTM C1046 and ASTM C1155. TRSYS20 is equipped with high-resolution electronics, two heat flux sensors of model HFP01 as well as two pairs of matched thermocouples for differential temperature measurements.

詳細はこちら
仕様
計測項目
  • 熱フラックス (2 x) , 温度 (2 x) , 温度差 (2 x)
全仕様
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仕様

計測項目
  • 熱フラックス (2 x) , 温度 (2 x) , 温度差 (2 x)
TRSYS20 仕様
  • :
建造物の R値およびU値
  • ISOやASTMの標準的なガイダンスに従ってユーザーが実行
規格
  • ISO 9869 and ASTM C1155 / C1046
測定地点数
  • 2
地点あたりのケーブル長
  • 地点1: 10 m, 地点2: 20 m
動作温度範囲 HFP01 and TC
  • -30 to +70 °C
校正の不確かさ
  • ± 3 % (k = 2)
ガード幅と厚みの比率
  • 5 m/m (as required by ISO 9869 D.3.1)
許容間隔温度差測定
  • < ± 0.1 °C (required by ISO 9869, paragraph 5.2)
測定時間
  • > 3 days
データ容量
  • > 30 days
商用電源アダプタ
  • 110-220 VAC, 50 / 60 Hz
MCU 仕様
  • :
温度差測定分解能
  • 0.02 °C
熱フラックス測定分解能
  • 0.02 W/m²
PCとのデータ通信
  • local area network (LAN) via ethernet or directly to PC via USB
マニュアル & ダウンロード
TRSYS20 カタログ
TRSYS20 マニュアル

詳細

Building thermal resistance measuring system

The high-sensitivity HFP01 heat flux sensors combined with the robust, high-resolution electronics ensure that TRSYS20 continues making meaningful measurements when other systems no longer perform; in particular at very low heat fluxes and low temperature differences across the wall. The matched thermocouple pairs allow measurement of temperature differences with an uncertainty better than 0.1 °C over the entire temperature range. Two measurement locations provide redundancy allowing the user to verify that the measurement results are representative for the building envelope component.

User interface: MCU as a web server

TRSYS20 is controlled via a PC. No software installation is required. The measurement and control unit (MCU) can be connected to a local area network (LAN) via ethernet or directly to a PC via USB. The MCU provides a graphical user interface in the form of a webpage that is accessible through a web browser. The graphical user interface allows the user to start and stop experiments; to monitor real-time heat flux, temperature and temperature difference measurement data; and to review preliminary results.

The system generates a data file, containing the measurement time, heat flux, temperature and temperature difference for the two measurement locations. The data file is stored in the MCU and can be downloaded through the graphical user interface. The user is responsible for the data analysis, calculating the R-, Λ- or U-value of the building envelope according to the ISO 9869 or ASTM C1155 standards.

Unique features and benefits

  • robust and stable
  • best paperwork: complies with ISO and ASTM standards
  • temperature difference sensors: tested for 0.1 °C accuracy requirements
  • simultaneous measurements on two locations
  • measures very small heat fluxes
  • intuitive and easy to use graphical user interface
  • connection via ethernet (LAN) or USB
  • water- (rated IP67) and corrosion proof sensors

Calibration & conformity assessment

Calibration of TRSYS20 components is traceable to international standards.  TRSYS20 is provided with formally traceable calibration certificates.  HFP01 heat flux sensors are calibrated in accordance with ASTM C1130. Temperature difference sensors are “individually” tested as matched pairs.

推奨用途

  • 建築物のU値・R値測定
TRSYS20 熱フラックス計測システム
TRSYS20 熱フラックス計測システム
  • high-accuracy in-situ building R-value measurements
  • best paperwork: complies with ISO and ASTM standards
  • temperature difference sensors: tested for 0.1 °C accuracy requirements
製品についてのご質問

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